TM 9-4931-436-14&P
5-4. LOGIC TREE DIAGRAM. The CORREC-
activity is started. The logic tree
TIVE ACTION column of table 5-l
must be used from the beginning.
contains reference to a logic tree
the logic tree directs the user to
The logic tree begins with theassumption
that the initial condition identified
to perform system test from the begin-
ning to validate the troubleshooting
established before troubleshooting
and repair activity.
Section III.
GENERAL
MAINTENANCE
5-5. ALIGNMENT DEVICE GENERAL MAINTE-
to threads of all fastener screws and
NANCE. This section contains general
threaded components. Insulating com-
repair instructions (not specific to
pound, (Part No. 11749371), should be
one component or assembly) which would
applied to all new solder connections.
otherwise have to be repeated several
(Refer to note below.)
times. These instructions relate to
sealing and insulating compounds, sol-
tions should comply with MIL-STD-454,
Requirement 5. Comply with MIL-STD-
dering, and workmanship.
454, Requirement 1, for grounding and
5-6.
CLEANING OF COMPONENTS.
safety instructions.
Comply with MIL-
a. Metal Surfaces. Clean all exposed
5-9. WORKMANSHIP.
metal surfaces with a lint-free cloth.
STD-454, Requirement 9, for workmanship.
If necessary, dampen the cloth with
NOTE
water. Allow these surfaces to dry
thoroughly before storing.
b . Display Faces. Clean display
To obtain accurate voltage and
current readings, use a needle
faces with a soft, lint-free cloth. If
necessary, dampen the cloth with water.
point probe because of insu-
lating compound on solder con-
Wipe dry with a soft, lint-free cloth.
nections. Cure time for insu-
lating compound is 2 hours at
5-7. SEALING AND INSULATING. Apply
60C 5O or 24 hours at room
primer (MIL-S-22473, grade T) and
temperature.
locking compound (MIL-S-22473, grade C)
5-11 (5-12 blank)